Reflow Tutorial With Equipment List

Found a collection of tutorials and information some is mine while most is contributed by forum members. Took me a while to find it so thought i would post it as a tut, since its explains all the steps for noobs.
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Nozzles
CPU #3939, GPU #4141, SBridge #2828, Hana #1919
Personally i use the #4141 for the ram and sometimes the CPU, but i have a #3939 just to be safe, I use the #2828 for the hana and to do each ram chip individually as well

Reflow Holder
A dremel stand which MUST be modified or something similar

Preheater This is the cheap option, a T8280 is recommended

Thermocouple This is a must have, dont be cheap and the dual version makes things so much easier and safer so you can make sure top and bottom temps are in safe ranges

Kapton TapeResists heat and is used to hold down the thermo wires

Flux
No clean version, the ebay store sells only the freshes high quality flux dont get it anywhere else

Follow this detailed guide
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I included a few different tutorials, as its best to try several and then mix and match to find out which works best for you as each setup and workshop is different

This is the profile for reflowing the CPU and GPU:

Items Required: Aoyue 968 Repairing System, Air Nozzle Y3939, Air Nozzle Y4141, Rosin Flux Liquid (Must be Lead Free), Walmart Presto Griddle, Custom made stand for air flow device, and Squirt bottle for liquid flux.

Step One: Use squirt bottle with small nozzle to insert flux between BGA and board. Make sure board is on its side in a vertical position. You want flux to ooze out the bottom of the BGA. Rotate the board until flux is coming out of all 4 corners to be sure of an even coverage of flux. (This is optional, we do NOT do this step.)

Step Two: Preheat griddle to 350F. Be sure the motherboard is raised ¾ of an inch off of the griddle. Use JB weld, washers, and machine screws to achieve this. Allow the board to preheat for 5 mins. Heat the board itself for 5 mins.

Step Three: Use makeshift stand to hold air gun. You do not want to hold it by hand because the chip needs even coverage of heat profile for 5 total mins. Place gun and proper nozzle over the chip you wish to repair. Set the Air flow system to its lowest heat setting at 90C for one min. You want an air flow setting of 5. Any higher will result in the air flow blowing important parts off of the board.

Step Four: Turn Air flow machine up to 195C (This will make the flux boil) for one min.

Step Five: Turn off the Griddle.

Step Six: Step up temperature on air flow 3C every one second until the unit reaches 350C/360C. (The temperature at which solder reflows) Hold at 350C for 10 seconds for CPU, hold at 360C for 15 seconds for GPU.

Step Seven: Step down temperature on air flow 3C every one second until the unit reaches back to 290C.

Step Eight: Drop temperature to 90C as fast as the machine will allow. Turn off machine and DO NOT disturb the board for 15 mins while the solder hardens.

original tutorial and video.....

here is the forum thread where they came up with the idea...
Me me me

Some tips i have learned, the bottom controls most of the heat. The reflow station provides the rest of the heat to perform the actual reflow.

Clean the chips with alcohol, let dry and then use flux. I have a 2ml bottle with needle that makes it extremely easy to squirt.

Bake the board on the preheater for 8hrs or overnight at around 80c which should show on the bottom thermocouple temp. Baking removes flex in the board which basically means the board even though it looks flat really isnt any longer trust me there will be lots of cracking during the baking which means its flattening itself.

Heat shield is not at all necessary as long as you have the proper nozzles. But again it doesnt hurt to have it.